Category Archives : Evénements

Dear colleague, We announce the international conference ICOMP’18. After the success of the last editions held in Saint-Etienne, France in September 2014, in Liège, Belgium on May 2016,  the 3rd International conference on COmputational methods in Manufacturing Processes (ICOMP’18) will be held in Barcelona, Spain on 5-7 september 2018. https://icomp18.sciencesconf.org/ The 3 rd International conference on COmputational methods in Manufacturing Processes (ICOMP’18),  will […]

                                                                              9h00-9h30 – Besoin et Activité ArianeGroup sur les problématiques de contrôle de collages structuraux. David BARNONCEL, Ariane Group, Saint-Médard-En-Jalles (33) 9h30-10h00 – Contrôle d’assemblages collés par imagerie THz. Thierry ANTONINI, Térahertz Waves Technologies, Montpellier (34) 10h00-10h30 – Conception d’un procédé de contrôle non-destructif d’un assemblage collé par ultrasons non-linéaires. Guillemette RIBAY, CEA List, Gif-sur-Yvette […]

                                                                              9h15-9h30 – Accueil par Guy LARNAC, Ariane Group 9h30-10h10 – Conférence plénière : titre et intervenant à venir 10h10-10h40 – Method for the estimation of in plane thermal diffusivity fields on heterogeneous and anisotropic materials by infrared thermography. Christophe PRADERE, I2M Univ. de Bordeaux, Talence (33). 10h40-11h10 – Pause café près des stands 11h10-11h40 – […]

“MS50: Multi-scale models of interfacial layers” The deadline for presenting a one-page abstract is December 15, 2017. Information regarding the minisymposium and the ECCM-ECFD 2018 Conference can be found at the congress web page: http://www.eccm-ecfd2018.org    

Deadline for abstract submission: January 19, 2018. CMIS 2018 : http://conference.unisalento.it/ocs/index.php/cmis/cmis2018 Flyer: Flyer_cmis2018 We would like to inform you that abstract submission for the Symposium is now opened untill January 19, 2018. We would appreciate your participation to the Symposium which is the opportunity to gather every two years the contact mechanics community. As usual, […]